Product overview：

AMP-20SA can effectively remove organic pollutants and natural oxide layers from the surface of materials, activate the surface of the material, enhance the quality of bonding and welding, and will not cause physical bombardment damage to the materials. 

Applications: Primarily used for cleaning in the packaging process of ICs, IGBTs, optoelectronics, MEMS devices to improve the quality of soldering and bonding. It can also be used for photoresist removal and polymer surface activation.

Features：

High-density plasma

No physical damage

Ultra short cleaning time

Strong antioxidant effect

High uniformity cleaning effect

Support automated production (optional)