Applications

The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, capable to effectively remove the surface contaminants of organics and oxides from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. The system possesses a large-capacity chamber and advancedly-designed electrodes, combing high-uniformity cleaning and production efficiency.

Features

Outstanding clean result & reliable performance

High capacity: Max 16 magazines loading capacity

Superior vacuum performance with oil pump + booster pump

Slim structure with pump built-in

Advanced electrode design & excellent uniformity

Intuitive graphical user interface

Specifications